Peter Yu Fei Huang

Title: Innovations of Peter Yu Fei Huang

Introduction

Peter Yu Fei Huang is an accomplished inventor based in Pleasant, CA (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to three-dimensional stacking structures.

Latest Patents

Huang's latest patents include a detailed description of a three-dimensional stacking structure. This structure comprises at least a bottom die, a top die, and a spacer protective structure. The bottom die features contact pads in the non-bonding region, while the top die is stacked on the bottom die without covering these contact pads. The bonding between the bottom and top dies is achieved through bonding structures. Additionally, the spacer protective structure is placed on the bottom die to safeguard the top die. By creating an anti-bonding layer before stacking, the top die can be partially removed to reveal the contact pads of the bottom die for further connections. His second patent elaborates on the same three-dimensional stacking structure and its manufacturing methods, emphasizing the innovative aspects of the design and functionality.

Career Highlights

Peter Yu Fei Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of three-dimensional stacking structures, which are crucial for modern electronic devices.

Collaborations

Huang collaborates with Chaochieh Tsai, contributing to the development of innovative solutions in the semiconductor industry.

Conclusion

Peter Yu Fei Huang's contributions to the field of semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a leading inventor in the industry. His innovative designs are paving the way for future advancements in electronic device manufacturing.