New Albany, IN, United States of America

Peter Wrschka

This inventor holds 1 USPTO granted patent. Top assignee: Samtec Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Wrschka. Retrieved from https://idiyas.com/inventor/peter-wrschka-vb3u0nhe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Peter Wrschka

Introduction

Peter Wrschka is an accomplished inventor based in New Albany, Indiana. He has made significant contributions to the field of electrically conductive materials. His innovative work has led to the development of a patent that addresses the challenges of filling vias in substrates.

Latest Patents

Peter Wrschka holds a patent for "Filling materials and methods of filling vias." This patent discloses electrically conductive pastes that are specifically designed to fill holes in substrates. The paste can be cured within the hole, resulting in an electrically conductive metallized via. Additionally, the patent includes fills that perform effectively at high temperatures. He has 1 patent to his name.

Career Highlights

Peter is currently employed at Samtec Incorporated, where he continues to innovate in the field of conductive materials. His work at Samtec has allowed him to apply his expertise in developing advanced solutions for electronic applications.

Collaborations

Peter has collaborated with notable coworkers, including Thomas Jacob Hammann and Adam Owens. Their combined efforts contribute to the innovative environment at Samtec Incorporated.

Conclusion

Peter Wrschka's contributions to the field of electrically conductive materials demonstrate his commitment to innovation and excellence. His patent for filling materials showcases his ability to solve complex engineering challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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