Company Filing History:
Years Active: 2017
Title: Peter Tijssen: Innovator in Substrate Bonding Technologies
Introduction
Peter Tijssen is a notable inventor based in Enschede, Netherlands. He has made significant contributions to the field of substrate bonding technologies, holding 2 patents that showcase his innovative approaches.
Latest Patents
One of Tijssen's latest patents is a "Method for forming an electrically conductive via in a substrate." This method involves forming a through hole in a first substrate, bringing a second substrate into contact with the first, and filling the hole with an electrically conductive material through electroplating. The process ensures that the surfaces of both substrates have a surface roughness of less than 2 nm, promoting a direct bond between them.
Another significant patent is the "Method of bonding two substrates and device manufactured thereby." This invention outlines a method for bonding substrates made from various materials, including glass and silicon, using an intermediate thin film metal layer. The steps include depositing the thin film on a first substrate, bringing a second substrate into contact with it, and strengthening the bond locally.
Career Highlights
Peter Tijssen is currently associated with Micronit Microfluidics B.V., where he continues to develop innovative solutions in microfluidics and substrate technologies. His work has been instrumental in advancing the capabilities of micro-manufacturing processes.
Collaborations
Tijssen collaborates with talented professionals such as Ronny Van 't Oever and Marko Theodoor Blom, contributing to a dynamic and innovative work environment.
Conclusion
Peter Tijssen's contributions to substrate bonding technologies reflect his commitment to innovation and excellence in the field. His patents not only demonstrate his technical expertise but also pave the way for advancements in microfluidics and related applications.