This inventor holds 1 USPTO granted patent. Top assignee: Ihp Gmbh-Innovations for High Performance Microelectronics/institut Fur Innovative Mikroelektronik. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Peter Schley - Innovator in Substrate Wafer Technology
Introduction
Peter Schley is a notable inventor based in Frankfurt-am-Main, Germany. He has made significant contributions to the field of microelectronics, particularly in the development of substrate wafers. His innovative approach aims to enhance the performance and reliability of digital and analog circuits.
Latest Patents
Peter Schley holds a patent related to "Layers in Substrate Wafers." This invention addresses the limitations of conventional assemblies by providing layers that improve resistance to latch-up in highly scaled digital CMOS circuits while maintaining low costs. Additionally, it ensures minimal substrate losses and couplings for analog high-frequency circuits. The invention utilizes a highly resistive p-Si substrate with buried high-carbon Si layers, which enhances component behavior without causing damage.
Career Highlights
Peter Schley is associated with IHP GmbH - Innovations for High-Performance Microelectronics, where he continues to push the boundaries of microelectronic technology. His work focuses on creating solutions that meet the demands of modern electronic applications.
Collaborations
Peter has collaborated with esteemed colleagues such as Bernd Heinemann and Karl-Ernst Ehwald, contributing to advancements in the field through shared expertise and innovative ideas.
Conclusion
Peter Schley's contributions to substrate wafer technology exemplify the impact of innovation in microelectronics. His work not only addresses current challenges but also paves the way for future advancements in the industry.