This inventor holds 2 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignee: Siemens Aktiengesellschaft. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Peter Randelzhofer: Innovator in Solder Technology
Introduction
Peter Randelzhofer is a notable inventor based in Erlangen, Germany. He has made significant contributions to the field of solder technology, holding a total of 2 patents. His work focuses on developing advanced solder materials that enhance the performance and reliability of components used in high-temperature applications.
Latest Patents
Randelzhofer's latest patents include innovative solutions such as a germanium-containing solder and a cobalt-based alloy comprising germanium. The germanium-containing solder is designed to reduce the proportion of γ' formed in the solder, which is crucial for maintaining the integrity of solder joints. This solder includes a composition similar to nickel-based superalloys, incorporating elements like chromium, cobalt, molybdenum, tungsten, aluminum, and titanium. Additionally, his cobalt-based solder alloys utilize germanium, which has a higher melting point than nickel-based alloys. This feature makes it particularly advantageous for repairing or treating components that operate at high temperatures.
Career Highlights
Peter Randelzhofer is currently employed at Siemens Aktiengesellschaft, where he continues to innovate in the field of solder technology. His expertise and contributions have positioned him as a key figure in the development of advanced materials for various applications.
Collaborations
Throughout his career, Randelzhofer has collaborated with talented colleagues, including Sebastian Piegert and Robert Singer. These collaborations have further enriched his work and contributed to the advancement of solder technology.
Conclusion
Peter Randelzhofer's contributions to solder technology through his patents and work at Siemens Aktiengesellschaft highlight his role as an influential inventor in the field. His innovative approaches to solder materials are paving the way for improved performance in high-temperature applications.