Hanau, Germany

Peter Prenosil

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Maintal, DE (2016)
  • Hanau, DE (2015 - 2018)

Company Filing History:


Years Active: 2015-2018

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3 patents (USPTO):Explore Patents

Title: Peter Prenosil: Innovating Bonding Wires in Microelectronics

Introduction

Peter Prenosil, an inventive mind based in Hanau, Germany, holds three patents that showcase his contributions to the field of microelectronics. His work primarily centers around advancements in bonding wires, crucial for connecting components in electronic devices.

Latest Patents

His latest invention, "Aluminum coated copper bond wire and method of making the same," describes a bonding wire that features a copper core with an aluminum coating. This wire is specifically designed for microelectronics and includes tightly defined specifications such as a coating layer thickness ratio that ranges from 0.05 to 0.2 µm and diameters between 100 µm and 600 µm. Furthermore, it details a process for fabricating this wire and its application in electric devices and propelled devices through wedge bonding techniques.

Another notable patent is the "Core-jacket bonding wire," which presents a bonding wire composed of a wire core made from one metal and a jacket made from another. This innovative design ensures efficiency in preventing damage to bonding surfaces during the bonding process and mitigates the risk of short-circuiting in sub-assemblies due to its optimal aspect ratio of no more than 0.8.

Career Highlights

Peter Prenosil is a key innovator at Heraeus Deutschland GmbH & Co. KG, where his expertise plays a vital role in the development of advanced bonding wire technologies. His creativity and technical knowledge have contributed significantly to the company's stature in the field.

Collaborations

Throughout his career, Prenosil has collaborated with esteemed colleagues such as Eugen Milke and Sven Thomas. This teamwork has resulted in improved bonding wire technologies and broader advancements in microelectronics.

Conclusion

Peter Prenosil stands out as an inventor whose work in bonding wires significantly impacts microelectronics. His patents reflect a commitment to innovation, establishing him as an influential figure in advancing technology within this crucial field.

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