The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Jul. 18, 2011
Applicants:

Eugen Milke, Frankfurt, DE;

Jürgen Dick, Bruchköbel, DE;

Peter Prenosil, Maintal, DE;

Frank-werner Wulff, Hanau, DE;

Poh Yoong Kong, Singapore, SG;

Inventors:

Eugen Milke, Frankfurt, DE;

Jürgen Dick, Bruchköbel, DE;

Peter Prenosil, Maintal, DE;

Frank-Werner Wulff, Hanau, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 5/02 (2006.01); H01L 23/00 (2006.01); B21F 45/00 (2006.01);
U.S. Cl.
CPC ...
H01B 5/02 (2013.01); B21F 45/00 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 2224/4321 (2013.01); H01L 2224/4381 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/43826 (2013.01); H01L 2224/43847 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45012 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45016 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45624 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/45686 (2013.01); H01L 2224/45687 (2013.01); H01L 2224/85001 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/2076 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/20759 (2013.01);
Abstract

A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.


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