Munich, Germany

Peter Leskovar

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Aktiengesellschaft. Active years: 1977.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Leskovar. Retrieved from https://idiyas.com/inventor/peter-leskovar-9ddrkozn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1977

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1 patent (USPTO):Explore Patents

Title: The Innovations of Peter Leskovar

Introduction

Peter Leskovar is an accomplished inventor based in Munich, Germany. He has made significant contributions to the field of engineering, particularly in the development of thick-layer conductor path pastes. His innovative work has led to the creation of a patent that showcases his expertise and creativity.

Latest Patents

Leskovar holds a patent for a thick-layer conductor path paste. This invention consists of a suspension of a powder mixture containing metals and fritted glass in an organic carrier medium. The patent also includes methods for making conductor paths and the paths produced through these methods. This innovation is crucial for various applications in electronics and materials science.

Career Highlights

Peter Leskovar is currently employed at Siemens Aktiengesellschaft, a leading global technology company. His role at Siemens allows him to collaborate with other talented professionals and contribute to cutting-edge projects. His work has not only advanced his career but has also had a lasting impact on the industry.

Collaborations

One of Leskovar's notable collaborators is Artur Weitze. Together, they have worked on various projects that leverage their combined expertise in engineering and materials science.

Conclusion

Peter Leskovar's contributions to the field of thick-layer conductor path pastes exemplify the spirit of innovation. His patent and work at Siemens highlight his dedication to advancing technology and engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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