This inventor holds 1 USPTO granted patent. Top assignee: Ams-Osram Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Peter Jerabek: Semiconductor Invention and Patent
Introduction
Peter Jerabek is an inventor associated with Graz, Austria, and Ams-Osram AG. His work includes a patented semiconductor design focused on through-substrate-via technology.
Latest Patents
Jerabek is associated with 1 patent: “Semiconductor Substrate Comprising a Through-Substrate-Via and Method for Producing Thereof.” The invention describes a semiconductor device with a substrate, an intermetal dielectric, and a metal layer containing a top barrier layer. A through-substrate via extends from the substrate’s rear surface through the substrate and dielectric, reaching the barrier layer. Metallization within the via electrically connects the metal layer from the rear side of the substrate.
Career Highlights
Jerabek’s patent reflects work on semiconductor structures and manufacturing methods. The described via arrangement provides an electrical connection through the substrate to a metal layer embedded in the intermetal dielectric.
Collaborations
The patent-related collaborators identified are Georg Parteder and Jörg Siegert. Jerabek is associated with Ams-Osram AG.
Conclusion
Peter Jerabek’s patent documents a through-substrate-via design that connects a semiconductor device’s rear surface to an embedded metal layer, highlighting his contribution to semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile