Location History:
- Sherfield, EN (1976)
- Pandale, GB (1984)
- Sherfield, GB (1984)
- Sherfield, English, Romsey, Hampshire, GB (1989)
- Romsey, GB (1984 - 1994)
Company Filing History:
Years Active: 1976-1994
Title: Innovations by Inventor Peter H Lemon
Introduction
Peter H Lemon, an accomplished inventor based in Romsey, GB, holds a remarkable portfolio of 10 patents. His innovations primarily focus on the development of phenolic resin compositions that have practical applications in various industries, particularly in foundry mould production and subterranean material treatment.
Latest Patents
Among his significant contributions, two notable patents include a phenolic resin composition aimed at bonding refractory materials, such as sand, for the creation of foundry moulds and cores. This invention introduces a unique mixture comprising an esterified phenolic compound, a phenolic novolak resin, and a base that triggers a cure in the presence of water or polar solvents. This composition ensures effective bonding of granular refractory materials, showcasing its utility in industrial applications. Another patent focuses on the methods for producing cured phenolic resin compositions, again emphasizing the use of esterified phenolic compounds and their environmental advantages by eliminating the release of alcohols during the curing process.
Career Highlights
Peter has garnered extensive experience working with reputable companies such as Borden (UK) Limited and Borden, Inc. His tenure in these organizations has significantly contributed to his expertise in resin technology and industrial applications.
Collaborations
Throughout his career, Peter has collaborated with professionals like Jeffrey D Railton and Derek W Baker. These partnerships have likely enriched his innovative approach and contributed to the success of his patented inventions.
Conclusion
Peter H Lemon's contributions to the field of phenolic resins underscore the importance of innovation in industrial applications. His work not only addresses current needs in manufacturing but also paves the way for future advancements in bonding materials and environmentally safe curing processes.