Peter Gansauge

Title: Innovations by Peter Gansauge in Integrated Circuit Packaging

Introduction

Peter Gansauge is a notable inventor based in Böblingen, Germany. He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work focuses on improving the manufacturing processes and structures used in semiconductor technology.

Latest Patents

Gansauge's latest patents include a method for manufacturing an integrated circuit chip bump electrode. This method involves creating a packaging structure that comprises a substrate, preferably a semiconductor base substrate, with a conductive layer where connections to metallization layers are formed. The structure includes solder balls and gold bumps connected to the conductive layer, along with a solder stop layer surrounding the solder balls. Notably, this method utilizes only two masks for providing terminals, which reduces the need for an additional metallization layer. This innovation is applicable to 200 mm wafers and supports two different packaging technologies, enhancing the packaging of VLSI circuits.

Career Highlights

Peter Gansauge is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to contribute to advancements in semiconductor technology and integrated circuit packaging.

Collaborations

Some of Gansauge's coworkers include Volker Kreuter and Helmut Schettler. Their collaboration has likely fostered an environment of innovation and development in their projects.

Conclusion

Peter Gansauge's contributions to integrated circuit packaging demonstrate his expertise and commitment to advancing semiconductor technology. His innovative methods and collaborative efforts continue to impact the industry positively.