Endicott, NY, United States of America

Peter G Bartolotta

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter G Bartolotta. Retrieved from https://idiyas.com/inventor/peter-g-bartolotta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: The Innovations of Peter G Bartolotta

Introduction

Peter G Bartolotta is an accomplished inventor based in Endicott, NY (US). He is known for his significant contributions to the field of electroless copper plating. With a focus on improving the stability of plating baths, Bartolotta has made strides in enhancing manufacturing processes.

Latest Patents

Bartolotta holds a patent for an "Electroless copper plating bath and improved stability." This innovative plating bath incorporates a cationic polymer derived from acrylamide and/or methacrylamide. Additionally, it contains a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion. This patent showcases his expertise in chemical engineering and materials science.

Career Highlights

Throughout his career, Bartolotta has been associated with the International Business Machines Corporation (IBM). His work at IBM has allowed him to collaborate with other talented professionals in the field. His dedication to innovation has positioned him as a key figure in the development of advanced plating technologies.

Collaborations

Some of Bartolotta's notable coworkers include Voya Rista Markovich and William J Amelio. Their collective efforts have contributed to the success of various projects within IBM.

Conclusion

Peter G Bartolotta's contributions to the field of electroless copper plating demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the industry, and his work continues to influence manufacturing processes today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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