Peter Fundaro

Title: **Inventor Spotlight: Peter Fundaro - Innovator in Multi-Chip Module Technology**

Introduction

Peter Fundaro is an accomplished inventor based in Dallas, Texas, with a strong portfolio of four patents. His work focuses primarily on innovations in packaging technologies, leading to significant advancements in multi-chip modules.

Latest Patents

Among his notable contributions, Peter has developed a groundbreaking multi-chip module leadless package. This innovative design features a leadframe with half-etched lead terminals and includes first and second die configurations. The first die is equipped with circuitry for receiving control signals and outputting coded signals, while the second die functions as a receiver with a gate driver. This package also incorporates a high-voltage isolation device to ensure the effective operation of the transmitter and receiver, all encapsulated within a mold compound for durability and reliability.

Career Highlights

Peter Fundaro has established himself as a key figure at Texas Instruments Corporation, a leader in technological innovation. His expertise in semiconductor packaging and multi-chip modules has propelled advancements in the industry, solidifying his reputation as a forward-thinking inventor.

Collaborations

Throughout his career, Peter has collaborated with talented coworkers such as Matthew David Romig and Wei Zhang. These partnerships have fostered a creative environment, enabling the development of innovative solutions within Texas Instruments Corporation and the broader tech community.

Conclusion

As an inventor, Peter Fundaro continues to make significant strides in technology, particularly in the realm of multi-chip module packaging. His commitment to innovation and collaboration underscores the importance of teamwork in the pursuit of excellence in the field of electronics.