Roedermark, Germany

Peter Dietrich

This inventor holds 1 USPTO granted patent. Top assignee: Heraeus Deutschland Gmbh & Co Kg. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Dietrich. Retrieved from https://idiyas.com/inventor/peter-dietrich-goca9ijm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Peter Dietrich: Innovator in Heat Exchange Technology

Introduction

Peter Dietrich is a notable inventor based in Rödermark, Germany. He has made significant contributions to the field of heat exchange technology. His innovative approach has led to the development of a unique heat exchange compound module.

Latest Patents

Peter Dietrich holds a patent for a heat exchange compound module. This invention relates to a heat exchange compound module and a manufacturing method for such a module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate features an outer layer made of a first metallic material. The heat exchange structure is constructed from a second metallic material and is connected to the outer layer of the metal-ceramic substrate solely by an eutectic bond between the first and second metallic materials. He has 1 patent to his name.

Career Highlights

Peter Dietrich is currently employed at Heraeus Deutschland GmbH & Co. KG, where he continues to innovate in the field of heat exchange technologies. His work has been instrumental in advancing the efficiency and effectiveness of heat exchange systems.

Collaborations

Peter collaborates with Ryan Persons, who is also involved in the development of innovative technologies within the company.

Conclusion

Peter Dietrich's contributions to heat exchange technology exemplify the spirit of innovation. His patent for the heat exchange compound module showcases his expertise and commitment to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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