Taipei, Taiwan

Perng-Kae Wang

This inventor holds 1 USPTO granted patent. Top assignee: Asustek Computer Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Perng-Kae Wang. Retrieved from https://idiyas.com/inventor/perng-kae-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Perng-Kae Wang: Innovator in Electronic Device Thermal Management

Introduction

Perng-Kae Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic devices, particularly in thermal management solutions. His innovative approach addresses the challenges faced by high-speed processors in dissipating heat effectively.

Latest Patents

Wang holds a patent for an "Electronic device and heat dissipating module thereof." This invention includes a circuit board with a thermal source and a heat dissipating module designed to enhance thermal dissipation efficiency. The module features a heat conducting unit, a first heat dissipating unit, and a second heat dissipating unit. The design allows for dual thermal dissipation modes, catering to the heat management needs of high-speed processors. He has 1 patent to his name.

Career Highlights

Perng-Kae Wang is currently employed at Asustek Computer Inc., a leading company in the technology sector. His work focuses on developing advanced electronic devices that meet the demands of modern computing.

Collaborations

Wang collaborates with talented individuals such as Chin-Lien Chang and Ea-Si Lee, who contribute to the innovative projects at Asustek Computer Inc. Their teamwork fosters a creative environment that drives technological advancements.

Conclusion

Perng-Kae Wang's contributions to electronic device thermal management exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing the performance of high-speed processors through effective heat dissipation solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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