Fujian, China

Pengpeng Wang

This inventor holds 1 USPTO granted patent. Top assignee: Contemporary Amperex Technology (Hong Kong) Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pengpeng Wang. Retrieved from https://idiyas.com/inventor/pengpeng-wang-pdau475l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Pengpeng Wang in Film Laminating Technology.

Introduction

Pengpeng Wang is a notable inventor based in Fujian, China. He has made significant contributions to the field of film laminating technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of electrode sheet processing.

Latest Patents

Wang holds a patent for a film laminating apparatus and an electrode sheet processing device. This invention includes a frame, a conveying mechanism, a mounting plate, and multiple film laminating mechanisms. The design allows for the efficient conveyance of an electrode sheet in a specified direction into the apparatus. The arrangement of the film laminating mechanisms is optimized to reduce the space occupied by the apparatus, making it more compact and efficient.

Career Highlights

Pengpeng Wang is currently associated with Contemporary Amperex Technology (Hong Kong) Limited. His work focuses on advancing technologies that improve the manufacturing processes of electronic components. His innovative designs have the potential to significantly impact the industry.

Collaborations

Wang collaborates with his coworker, Hong Lin, to further enhance their research and development efforts. Together, they aim to push the boundaries of technology in their field.

Conclusion

Pengpeng Wang's contributions to film laminating technology exemplify the spirit of innovation. His patent reflects a commitment to improving manufacturing processes and efficiency in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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