Shenzhen, China

Peng Wen

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Kiwi Instruments Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peng Wen. Retrieved from https://idiyas.com/inventor/peng-wen-1mmj0ao5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Peng Wen: Power-Electronics Inventor in Shenzhen

Introduction

Peng Wen is an inventor based in Shenzhen, China. His patent work addresses ripple suppression in quasi-resonant flyback power supplies, a power-conversion technology used in electronic systems.

Latest Patents

The supplied information lists one patent for Peng Wen: “Ripple Suppression Circuit and a Ripple Suppression Method for Quasi-Resonant Flyback Power Supply.” The invention describes a compensation circuit that generates a compensation signal based on bus voltage and a control circuit that compares two signals to control when the power switch turns off. By incorporating bus voltage into the compensated first signal, the circuit aims to reduce output ripple compared with a traditional control approach. The record provided does not specify the patent’s filing or grant date.

Career Highlights

Peng Wen is associated with Shenzhen Kiwi Instruments Corporation. His listed patent reflects work on improving power-supply control through bus-voltage compensation and signal comparison. The supplied information attributes 1 patent to him.

Collaborations

Guanqiu Lin is identified as Peng Wen’s coworker. The information provided does not specify whether Lin collaborated on the listed patent.

Conclusion

Peng Wen’s documented invention focuses on suppressing ripple in quasi-resonant flyback power supplies by using bus-voltage-based compensation to guide power-switch control.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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