Company Filing History:
2 out of 8 
1 out of 42 Years Active: 2022-2023
Title: Peng Liu: Innovator in Semiconductor Technology
Introduction
Peng Liu is a notable inventor based in Kunshan, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative encapsulation structures and methods that enhance the performance and reliability of electronic devices.
Latest Patents
One of his latest patents is titled "Semiconductor encapsulation structure and encapsulation method." This invention provides a semiconductor encapsulation structure that includes a circuit board with electromagnetic shield areas and non-electromagnetic shield areas. The design incorporates multiple metal line layers and insulating layers, along with a thin film encapsulation layer that covers both shield areas. Additionally, an electromagnetic shield structure is included to form a closed space with the circuit board.
Another significant patent is the "Package structure and method of manufacturing the same." This invention features a substrate with a solid grounded copper layer and multiple radio frequency chip modules. The design includes a plastic encapsulation that covers the chip modules and a groove filled with solder, ensuring effective shielding and connectivity.
Career Highlights
Peng Liu has worked with prominent companies such as Luxshare Electronic Technology Ltd. and Goodbaby Child Products Co., Ltd. His experience in these organizations has allowed him to apply his innovative ideas in practical settings, contributing to advancements in electronic packaging and semiconductor technologies.
Collaborations
Throughout his career, Peng Liu has collaborated with talented individuals, including Xiaolei Zhou and Wenbin Kang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Peng Liu's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor. His innovative encapsulation structures and methods continue to impact the electronics industry positively.