The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jul. 20, 2021
Applicant:

Luxshare Electronic Technology (Kunshan) Ltd., Kunshan, CN;

Inventors:

Xiaolei Zhou, Kunshan, CN;

Peng Liu, Kunshan, CN;

Wenbin Kang, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/522 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/5226 (2013.01); H01Q 1/2208 (2013.01);
Abstract

Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.


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