Guangdong, China

Peipei He

This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Bostik Sa. Active years: 2025.

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Peipei He: Innovator in Hot-Melt Pressure Sensitive Adhesives

Introduction

Peipei He is a notable inventor based in Guangdong, China. She has made significant contributions to the field of adhesive technology, particularly with her innovative work on hot-melt pressure sensitive adhesives. Her expertise and creativity have led to the development of a unique adhesive composition that has practical applications in various industries.

Latest Patents

Peipei He holds 1 patent for her invention titled "Low tack hot-melt pressure sensitive adhesives." This invention relates to a hot-melt pressure sensitive adhesive composition that includes at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil, and a specific percentage of waxes. The composition is designed to enhance the performance of adhesives in various applications, making them more effective and versatile.

Career Highlights

Peipei He is currently associated with Bostik SA, a leading company in adhesive solutions. Her role at Bostik has allowed her to further her research and development efforts in adhesive technologies. Her work has not only contributed to the company's portfolio but has also advanced the field of pressure sensitive adhesives.

Collaborations

Throughout her career, Peipei He has collaborated with talented individuals such as Xin Ye and Danfeng Li. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Peipei He is a remarkable inventor whose work in hot-melt pressure sensitive adhesives showcases her dedication to innovation. Her contributions to the field are significant and continue to influence adhesive technology.

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