Pei-Hung Kuo

Title: Pei-Hung Kuo and Semiconductor Packaging Innovation.

Introduction

Pei-Hung Kuo is an inventor associated with Taipei, Taiwan, and Tmy Technology Inc. Her patent work includes a package structure designed to support heat management in electronic devices.

Latest Patents

Kuo’s listed patent, “Package Structure,” describes a substrate supporting an electronic component and at least one heat conductor. An encapsulant covers the component and heat conductor, while a heat dissipation structure is positioned above the encapsulant. The design places the heat conductor in the area where the substrate contacts the electronic component, identified as the heat-generating area. The encapsulant’s height is at least as great as the heights of both the electronic component and the heat conductor. Kuo is credited with 1 patent in the information provided.

Career Highlights

Kuo’s documented patent activity focuses on electronic packaging and thermal management. Her work addresses the placement of heat-conducting elements near a component’s heat-generating area and their integration with an encapsulant and heat dissipation structure.

Collaborations

The provided information associates Kuo with Tmy Technology Inc. It does not specify additional collaborators or co-inventors for the listed patent.

Conclusion

Pei-Hung Kuo’s listed invention presents a package structure that integrates electronic components, heat conductors, encapsulation, and heat dissipation to address thermal management in electronic devices.