Pei Hsing Hua

Title: Pei Hsing Hua: Innovator in Semiconductor Technology

Introduction

Pei Hsing Hua is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that enhances the quality of semiconductor devices.

Latest Patents

Pei Hsing Hua holds a patent titled "Method for dicing a semiconductor wafer having through silicon vias and resultant structures." This invention provides a semiconductor device, a semiconductor package, and a semiconductor process. The process includes several steps: providing a semiconductor wafer with a first surface, a second surface, and a passivation layer; applying a first laser on the passivation layer to remove part of it and expose a section of the semiconductor wafer; using a second laser that passes through the exposed semiconductor wafer and focuses on its interior; and finally, applying a lateral force to the semiconductor wafer. This method ensures high cutting quality in semiconductor manufacturing.

Career Highlights

Pei Hsing Hua is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

Pei Hsing Hua collaborates with various professionals in his field, including his coworker Hui-Shan Chang, who is also a talented innovator in semiconductor technology.

Conclusion

Pei Hsing Hua's contributions to semiconductor technology through his patent demonstrate his commitment to innovation and excellence in the field. His work continues to impact the industry positively.