Taichung, Taiwan

Pei Haw Tsao


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Pei Haw Tsao

Introduction

Pei Haw Tsao is a notable inventor based in Taichung, Taiwan. He has made significant strides in the field of semiconductor technology with his innovative approach to solder bump structures. Pei's work not only enhances the efficiency of semiconductor devices but also reduces stress concentrations, which is crucial for the reliability of electronic components.

Latest Patents

Pei Haw Tsao holds a patent for a "Structure and method for low-stress concentration solder bumps." This groundbreaking patent details the creation of low-stress concentration solder bumps on semiconductor wafers through the removal of metal oxides from the under bump metallurgy (UBM). By allowing the solder to effectively wet the edges of the UBM, particularly the plated portion, Pei's method results in a solder bump structure with filled undercuts. This advancement leads to lower stress concentration in solder bump structures following the reflowing process on the wafer, which is vital for the durability of electronic devices.

Career Highlights

Pei Haw Tsao is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he applies his expertise in semiconductor engineering. His innovative contributions not only benefit his organization but also advance the broader industry standards in semiconductor manufacturing.

Collaborations

Throughout his career, Pei has collaborated with esteemed colleagues, including Chung Yu Wang and Chender Huang. These collaborations have been instrumental in pushing the boundaries of current technologies and achieving significant advancements in the field of semiconductor devices.

Conclusion

Pei Haw Tsao is an invaluable asset to the field of semiconductor technology, exemplified by his innovative patent for low-stress concentration solder bumps. His work enhances the reliability and performance of electronic devices, marking him as a prominent inventor whose contributions will undoubtedly have a lasting impact on the industry.

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