This inventor holds 1 USPTO granted patent. Top assignee: Daxin Materials Corporation. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Pei-Ci Cho: Innovator in Temporary Bonding Technologies
Introduction
Pei-Ci Cho is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging through his innovative work on temporary bonding compositions and methods.
Latest Patents
Pei-Ci Cho holds a patent for a temporary bonding composition, temporary bonding film, composite film, temporary bonding method, and semiconductor wafer package. This temporary bonding composition includes a polyfunctional crosslinker, a polymer, and a solvent. The polyfunctional crosslinker consists of a compound containing at least two functional groups selected from blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group blocked by a blocking agent. The polymer has a functional group that reacts with the polyfunctional crosslinker. He has 1 patent to his name.
Career Highlights
Pei-Ci Cho is currently employed at Daxin Materials Corporation, where he continues to develop innovative materials for the semiconductor industry. His work has been instrumental in advancing temporary bonding technologies, which are crucial for efficient semiconductor manufacturing.
Collaborations
Pei-Ci Cho has collaborated with several talented individuals in his field, including Cheng-Wei Lee and Chun-Hung Huang. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Pei-Ci Cho's contributions to temporary bonding technologies highlight his role as an important inventor in the semiconductor industry. His innovative approaches continue to influence the field and pave the way for future advancements.