Peeradech Kunpukdee

Title: Peeradech Kunpukdee: Innovator in Integrated Circuit Technology

Introduction

Peeradech Kunpukdee is a notable inventor based in Bangkok, Thailand. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the functionality of integrated circuit modules.

Latest Patents

Kunpukdee holds a patent for an "Integrated circuit module with filled contact gaps." This patent describes integrated circuit (IC) modules and methods for manufacturing these modules. In one embodiment, the IC module includes a substrate with contact gaps on which an IC die is attached, featuring electrical connections between the IC die and the substrate. The module is further enhanced by an encapsulation that encloses the IC die and fills the first portions of the contact gaps. These first portions are located within an area of the substrate defined by the encapsulation. Additionally, second portions of the contact gaps, which are located outside of this area, are filled with a filling material. This innovative design improves the reliability and performance of integrated circuits.

Career Highlights

Kunpukdee is associated with NXP B.V., a leading company in the semiconductor industry. His work at NXP B.V. has allowed him to collaborate with other talented professionals in the field. His contributions have been instrumental in advancing integrated circuit technology.

Collaborations

One of his notable coworkers is Bodin Kasemset. Together, they have worked on various projects that focus on enhancing the capabilities of integrated circuits.

Conclusion

Peeradech Kunpukdee's innovative work in integrated circuit technology exemplifies the importance of creativity and collaboration in the field of electronics. His patent for an integrated circuit module with filled contact gaps showcases his commitment to advancing technology. His contributions will continue to influence the industry for years to come.