Paul W Cotues

Title: The Innovations of Paul W. Cotues

Introduction

Paul W. Cotues is a notable inventor based in Yorktown Heights, NY. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.

Latest Patents

One of Paul W. Cotues's key patents is for a "Stepped Electronic Device Package." This patent describes an electronic device packaging structure where an electronic device is electrically connected to a substrate at a non-normal angle. The design allows for multiple electronic devices to be stacked at offsets, exposing contact locations on the surface of each device. This creates a stepped surface that facilitates electrical interconnections through solder mounds or elastomeric bodies with metallization bands. The innovative design also includes provisions for thermal connections to heat dissipation members, enhancing heat transfer from the device stack.

Career Highlights

Paul W. Cotues is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in electronic device technology. His work has been instrumental in advancing the capabilities of electronic packaging solutions.

Collaborations

Throughout his career, Paul has collaborated with notable colleagues, including Paul Andrew Moskowitz and Philip Murphy. These collaborations have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Paul W. Cotues exemplifies the spirit of innovation in the realm of electronic device packaging. His contributions, particularly through his patent for the stepped electronic device package, have paved the way for improved electronic device functionality and efficiency. His work continues to influence the industry and inspire future innovations.