This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Ethicon Endo-Surgery, Inc.. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: Paul W. Boentges: Innovator in Medical Packaging Solutions
Introduction
Paul W. Boentges is a notable inventor based in West Chester, OH (US). He has made significant contributions to the field of medical packaging, particularly with his innovative designs that enhance the distribution of medical instruments. His work is characterized by a commitment to improving safety and efficiency in medical environments.
Latest Patents
One of his key inventions is the Universal Blister Package. This patent involves a unique design that includes a tray and a retainer, both featuring resilient films. The innovative structure allows for selective engagement, creating a storage space that accommodates medical instruments securely between the tray and the retainer. This design not only protects the instruments but also facilitates their easy access and handling.
Career Highlights
Paul W. Boentges has dedicated his career to advancing medical packaging solutions. He is currently employed at Ethicon Endo-Surgery, Inc., where he continues to develop innovative products that meet the needs of healthcare professionals. His work has been instrumental in enhancing the safety and usability of medical instruments.
Collaborations
Throughout his career, Paul has collaborated with talented individuals such as Paul T. Marshall and Mark S. Leuenberger. These partnerships have fostered a creative environment that encourages the development of groundbreaking medical solutions.
Conclusion
In summary, Paul W. Boentges is a distinguished inventor whose contributions to medical packaging have made a significant impact on the industry. His innovative Universal Blister Package exemplifies his dedication to improving medical instrument distribution.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile