Cincinnati, OH, United States of America

Paul T Marhsall

This inventor holds 1 USPTO granted patent. Top assignee: Ethicon Endo-Surgery, Inc.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul T Marhsall. Retrieved from https://idiyas.com/inventor/paul-t-marhsall

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Paul T. Marshall

Introduction

Paul T. Marshall is a notable inventor based in Cincinnati, OH. He has made significant contributions to the field of medical instrument packaging. His innovative approach has led to the development of a unique product that enhances the distribution of medical instruments.

Latest Patents

Marshall holds a patent for a Universal Blister Package. This invention features a tray and a retainer, both equipped with resilient films. The design allows for selective engagement, creating a storage space that accommodates medical instruments securely between the tray and the retainer.

Career Highlights

Paul T. Marshall is associated with Ethicon Endo-Surgery, Inc., where he applies his expertise in medical packaging solutions. His work has been instrumental in improving the safety and efficiency of medical instrument distribution.

Collaborations

Some of his notable coworkers include Mark S. Leuenberger and Robert A. Allison. Their collaborative efforts contribute to the innovative environment at Ethicon Endo-Surgery, Inc.

Conclusion

Paul T. Marshall's contributions to medical packaging through his Universal Blister Package patent exemplify his commitment to innovation in the healthcare industry. His work continues to impact the way medical instruments are distributed and stored.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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