Company Filing History:
Years Active: 1988-1990
Title: An Overview of Inventor Paul R. Bie from Commack, NY
Introduction
Paul R. Bie is an accomplished inventor based in Commack, NY, with a remarkable portfolio of four patents to his name. His ground-breaking innovations in the field of semiconductor technology have significantly contributed to advancements in electrical contact structures.
Latest Patents
The latest patents attributed to Paul R. Bie focus on the T-type undercut electrical contact on a semiconductor substrate. These patents describe a unique contact structure and methodology that introduces a diffusion barrier to prevent migration from a gold layer into the active region of the semiconductor substrate. In one embodiment, the diffusion barrier is strategically placed at the base of the gold layer. In another embodiment, the gold layer is encapsulated by the diffusion barrier on both the bottom and sides. The innovative approach also includes the deposition of the diffusion barrier base layer and the electroplating of the side layers, with selective oxidation used to mask the remaining portions of the contact structure.
Career Highlights
Paul R. Bie is associated with Eaton Corporation, where he has focused his efforts on developing cutting-edge semiconductor technologies. His work has not only led to patentable inventions but also has enhanced the overall efficiency and reliability of electrical contacts within semiconductor devices.
Collaborations
Throughout his career, Paul R. Bie has collaborated with notable colleagues, including Joseph A. Calviello and Ronald J. Pomian. These collaborations have fostered a creative synergy that has propelled innovations in semiconductor technology forward.
Conclusion
In summary, Paul R. Bie stands out as a prominent inventor in the field of semiconductor technology. His latest patents and collaborations reflect his commitment to innovation and excellence, marking him as a significant figure within the technology sector. As he continues his work at Eaton Corporation, his future contributions are highly anticipated in the ever-evolving landscape of electronics.
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