This inventor holds 1 USPTO granted patent. Top assignee: Rf Micro Devices, Inc.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Paul Partyka: Innovator in Power Device Packaging
Introduction
Paul Partyka is an accomplished inventor based in Oak Ridge, NC (US). He has made significant contributions to the field of power device packaging, showcasing his expertise through his innovative patent.
Latest Patents
Paul Partyka holds a patent titled "Power device packaging having backmetals couple the plurality of bond pads to the die backside." This patent presents a power device that includes a die backside and a die frontside. The design features a semi-insulating substrate with epitaxial layers sandwiched between the die backside and the die frontside. The pads on the die frontside are coupled to the die backside using patterned backmetals that are disposed within vias, which pass through the semi-insulating substrate and epitaxial layers from the die backside to the die frontside. This innovative approach enhances the efficiency and functionality of power devices.
Career Highlights
Paul Partyka is currently employed at RF Micro Devices, Inc., where he continues to develop cutting-edge technologies in the field of power devices. His work has been instrumental in advancing the capabilities of power device packaging.
Collaborations
Paul has collaborated with Andrew P. Ritenour, further enhancing the innovative efforts within their organization.
Conclusion
Paul Partyka's contributions to power device packaging exemplify his commitment to innovation and excellence in engineering. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile