The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Jun. 05, 2013
Applicant:
Rf Micro Devices, Inc., Greensboro, NC (US);
Inventors:
Andrew P. Ritenour, Colfax, NC (US);
Paul Partyka, Oak Ridge, NC (US);
Assignee:
RF Micro Devices, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/66 (2006.01); H01L 21/338 (2006.01); H01L 21/20 (2006.01); H01L 29/20 (2006.01); H01L 21/02 (2006.01); H01L 29/417 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0254 (2013.01); H01L 29/4175 (2013.01); H01L 23/36 (2013.01); H01L 2224/16 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01);
Abstract
The present disclosure provides a power device and power device packaging. Generally, the power device of the present disclosure includes a die backside and a die frontside. A semi-insulating substrate with epitaxial layers disposed thereon is sandwiched between the die backside and the die frontside. Pads on the die frontside are coupled to the die backside with patterned backmetals that are disposed within vias that pass through the semi-insulating substrate and epitaxial layers from the die backside to the die frontside.