Paul Joseph Pikna

Title: Paul Joseph Pikna: Innovator in Semiconductor Technology

Introduction

Paul Joseph Pikna is a notable inventor based in Enosburg Falls, VT (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on the development of advanced probe assemblies that enhance the testing of semiconductor devices.

Latest Patents

Pikna's latest patents include the "Micro probe ring assembly and method of fabrication." This invention describes a multi-probe ring assembly that features integral fine probe tips and conductive lines with terminal connections for testing semiconductor devices. The construction method involves etching pits into silicon wafers to create molds for forming the probe points, utilizing semiconductor machining processes to complete the assembly. Another significant patent is the "Micro probe assembly and method of fabrication," which details a probe assembly that includes an integral fine probe tip and conductive line for testing semiconductor devices. Similar to his previous patent, this method also employs etching pits into silicon wafers to produce molds for the probe point.

Career Highlights

Pikna is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to work on cutting-edge technologies and contribute to advancements in semiconductor testing.

Collaborations

Throughout his career, Pikna has collaborated with notable colleagues, including Anthony M Palagonia and John Thomas Maddix. These collaborations have further enriched his work and contributed to the development of innovative technologies in the semiconductor field.

Conclusion

Paul Joseph Pikna is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the industry. His contributions continue to impact the field, showcasing the importance of innovation in technology.