Paul Harlan Rekemeyer

Title: Paul Harlan Rekemeyer: Innovator in Microelectronic Assembly

Introduction

Paul Harlan Rekemeyer is a notable inventor based in Cambridge, MA (US). He has made significant contributions to the field of microelectronics, particularly through his innovative patent related to through-silicon transmission lines.

Latest Patents

Rekemeyer holds a patent titled "Through-silicon transmission lines and other structures enabled by same." This patent describes a microelectronic assembly that includes an assembly support structure and a first die featuring a pair of hot vias. These hot vias comprise through-substrate-via (TSVs) that extend through the first die between its first and second sides. Surrounding the hot vias are a plurality of ground vias, which also extend through the first die. The first die is equipped with signal interconnect structures that are electrically connected to the hot vias and are located on the second side of the die. Additionally, a second die is positioned between the assembly support structure and the first die, with the signal interconnect structures disposed on its first side. The connection between the first and second dies is facilitated by a signal die-to-die (DTD) interconnect structure.

Career Highlights

Rekemeyer is currently employed at Analog Devices, Inc., where he continues to innovate in the field of microelectronics. His work has been instrumental in advancing technologies that enhance the performance and efficiency of microelectronic assemblies.

Collaborations

Throughout his career, Rekemeyer has collaborated with notable colleagues, including William B. Beckwith and Ed Balboni. These collaborations have contributed to the development of cutting-edge technologies in the microelectronics sector.

Conclusion

Paul Harlan Rekemeyer is a distinguished inventor whose work in microelectronic assembly has led to significant advancements in the field. His patent on through-silicon transmission lines exemplifies his innovative spirit and dedication to technology.