Company Filing History:
Years Active: 2009
Title: Paul Godijn - Innovator in Electronic Assembly
Introduction
Paul Godijn is a notable inventor based in Huizen, Netherlands. He has made significant contributions to the field of electronic assembly, particularly through his innovative patent related to solder preforms. His work has implications for improving the efficiency and effectiveness of electronic component attachment.
Latest Patents
Paul Godijn holds a patent for "Solder preforms for use in electronic assembly." This invention involves a solder preform designed to attach electronic components to substrates. The preform is specifically engineered for placement by a pick-and-place machine, utilizing a vacuum nozzle to pick the preform from a holder. Each side of the preform is configured to function as a vacuum side pickup surface, featuring an enlarged planar surface area. Additionally, the patent discloses methods for forming such solder preforms, showcasing Godijn's innovative approach to electronic assembly.
Career Highlights
Paul Godijn is associated with Fry's Metals, Inc., where he applies his expertise in electronic assembly. His role at the company allows him to further develop and refine his inventions, contributing to advancements in the industry. With a focus on practical applications, Godijn's work is instrumental in enhancing electronic manufacturing processes.
Collaborations
Paul collaborates with talented individuals such as Wim Veldhuizen and Patrick Lusse. Their combined efforts foster a creative environment that encourages innovation and the development of new technologies in electronic assembly.
Conclusion
In summary, Paul Godijn is a distinguished inventor whose work in solder preforms has the potential to revolutionize electronic assembly. His contributions, along with his collaborations, highlight the importance of innovation in advancing technology.