The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Dec. 15, 2004
Applicants:

Paul Godijn, Huizen, NL;

Wim Veldhuizen, Leersum, NL;

Patrick Lusse, Delft, NL;

Mitchell T. Holtzer, Rockaway, NJ (US);

Rob Van Ekeren, Utrecht, NL;

Martin DE Haan, Driebergen, NL;

Inventors:

Paul Godijn, Huizen, NL;

Wim Veldhuizen, Leersum, NL;

Patrick Lusse, Delft, NL;

Mitchell T. Holtzer, Rockaway, NJ (US);

Rob van Ekeren, Utrecht, NL;

Martin de Haan, Driebergen, NL;

Assignee:

Fry's Metals, Inc., Jersey City, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.


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