This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Fry's Metals, Inc.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: The Innovations of Mitchell T. Holtzer
Introduction
Mitchell T. Holtzer is an accomplished inventor based in Rockaway, NJ (US). He has made significant contributions to the field of electronic assembly through his innovative designs and patents. His work focuses on improving the efficiency and effectiveness of electronic component attachment processes.
Latest Patents
Holtzer holds a patent for "Solder preforms for use in electronic assembly." This invention involves a solder preform designed to attach electronic components to substrates. The preform is specifically engineered for placement by a pick-and-place machine, utilizing a vacuum nozzle to pick the preform from a holder. Each side of the preform is configured to function as a vacuum side pickup surface, featuring an enlarged planar surface area. Additionally, the patent discloses methods for forming such solder preforms, showcasing Holtzer's innovative approach to electronic assembly.
Career Highlights
Mitchell T. Holtzer is currently employed at Fry's Metals, Inc., where he continues to develop and refine his inventions. His work at the company has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to electronic assembly technologies.
Collaborations
Holtzer has worked alongside notable colleagues such as Paul Godijn and Wim Veldhuizen. Their collaborative efforts have fostered an environment of innovation and creativity, leading to advancements in electronic assembly techniques.
Conclusion
Mitchell T. Holtzer's contributions to the field of electronic assembly through his patent and collaborative work exemplify his dedication to innovation. His inventions continue to influence the industry, showcasing the importance of creativity in technological advancements.