Company Filing History:
Years Active: 1993
Title: The Innovative Contributions of Paul D Asetta
Introduction
Paul D Asetta is a notable inventor based in Mesa, AZ, who has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, Asetta's work focuses on improving the handling and processing of fragile semiconductor wafers. His innovative approaches have garnered attention in the industry, particularly for their practical applications.
Latest Patents
Asetta's latest patents include an "Apparatus and method for handling fragile semiconductor wafers." This invention provides a sophisticated apparatus that utilizes a vacuum chuck to hold the wafer securely while applying solvent to the back surface of the submount. The design incorporates an inert gas environment to protect the wafer during processing. Another significant patent is the "Semiconductor wafer wax mounting and thinning process," which details a method for bonding semiconductor wafers to submounts using a uniform wax layer. This process minimizes air voids and reduces stress on the wafers, enhancing their reliability during manufacturing.
Career Highlights
Paul D Asetta has built a successful career at Motorola Corporation, where he has been instrumental in advancing semiconductor technologies. His expertise in wafer handling and processing has positioned him as a key figure in the field. Asetta's innovative solutions have not only improved manufacturing processes but have also contributed to the overall efficiency of semiconductor production.
Collaborations
Throughout his career, Asetta has collaborated with talented individuals such as Lawrence R Gardner and Michael P Norman. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor industry.
Conclusion
In summary, Paul D Asetta's contributions to semiconductor technology through his patents and work at Motorola Corporation highlight his role as an influential inventor. His innovative methods for handling fragile semiconductor wafers have paved the way for advancements in the industry.