The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1993
Filed:
Apr. 06, 1992
Paul D Asetta, Mesa, AZ (US);
Lawrence R Gardner, Chandler, AZ (US);
Michael P Norman, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An apparatus (60) which handles fragile semiconductor wafers (21) adhesively mounted to a submount (22) using a high temperature wax is provided. The apparatus (60) includes a vacuum chuck (24) for holding a first surface of the wafer (21) and a solvent chamber (11, 11') for applying solvent to the back surface of the submount (22). The apparatus (60) includes an enclosure (29) for providing an inert gas environment around the solvent chamber (11, 11'), the wafer (21), and the vacuum chuck (24). The apparatus (60) further includes a means for remounting (30) the wafer (21) to a submount (22) using a low temperature wax after the high temperature wax is dissolved. The wafer (21) is then released from the vacuum chuck (24) and the first surface of the wafer (21) is mounted to an adhesive tape (34). Following the mounting, the low temperature wax is dissolved or melted to demount the wafer (21 ) from the submount (22), leaving the wafer (21) securely mounted on the adhesive tape (34) for sawing.