This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Via Telecom Co., Ltd., Via Telecom, Inc. Active years: 2009-2015.
IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul Chun-Hsiung Wei. Retrieved from https://idiyas.com/inventor/paul-chun-hsiung-wei
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
USPTO Granted Patents = 2 (Patent Applications = 1)
% Patents Active = 50.0
Average Co-Inventor Count = 1.6
ph-index = 1
Forward Citations = 7(Granted Patents)
Company Filing History:
Years Active: 2009-2015
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2 patents (USPTO):Explore Patents
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
1 patent pending:
IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul Chun-Hsiung Wei. Retrieved from https://idiyas.com/inventor/paul-chun-hsiung-wei
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]