Carmel, IN, United States of America

Paul C Staab


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2002

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2 patents (USPTO):Explore Patents

Title: Paul C. Staab: An Innovator in Integrated Circuit Packaging

Introduction

Paul C. Staab, an accomplished inventor based in Carmel, IN, has significantly contributed to the field of integrated circuit technology. With a total of two patents to his name, Staab's innovative spirit has led to advancements in power packaging methods that are particularly beneficial in automotive applications.

Latest Patents

Among his notable patents is the "Press-fit IC power package and method therefor." This invention addresses the design of an IC power package suitable for use as a rectifier in automotive AC generators. The power package features an electrically-conductive base with a MOSFET die connected to it, ensuring efficient power distribution. The assembly includes a conductive pin linked to the MOSFET's source region and a conductive member connected to its gate region. This inventive approach allows for multiple configuration options, enhancing the robustness of the IC package. Additionally, Staab holds a patent for a "Method for integrated circuit packaging," which streamlines the fabrication of microelectronic device packages through continuous processing, ultimately reducing costs compared to traditional batch processing methods.

Career Highlights

Paul C. Staab currently works at Delphi Technologies, Inc., a leader in innovative automotive solutions. His expertise and creativity have led to pivotal advancements within the company, particularly in the realm of microelectronics and automotive technology.

Collaborations

Throughout his career, Staab has collaborated with several talented colleagues, including Pankaj Mithal and Patrick A. Davis. These partnerships have played a pivotal role in fostering a dynamic and innovative work environment, contributing to the success of their projects.

Conclusion

Paul C. Staab stands out as a significant figure in the innovation of integrated circuit packaging. Through his patents and collaborations, he continues to impact the automotive industry positively, driving forward the capabilities of microelectronic devices. His work exemplifies how inventive minds can transform technology and improve everyday applications.

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