Patrick J Redmond

Title: Patrick J. Redmond and the Barrier Disk Patent.

Introduction

Patrick J. Redmond is an inventor associated with Fullerton, California, and Rockwell International Corporation. His recorded patent concerns a barrier disk designed to keep an aluminum wire from directly contacting a gold substrate during bonding. Redmond is credited with 1 patent.

Latest Patents

Redmond’s listed patent, “Barrier disk,” describes a layered structure made by sputtering tungsten onto aluminum foil and then sputtering gold onto the tungsten. The gold layer may be positioned next to a gold substrate, with the three-layer combination bonded to the substrate using a stylus that applies ultrasound at a moderately elevated temperature. This process leaves an aluminum region beneath the stylus tip available for bonding an aluminum wire, while preventing direct contact between the wire and the gold substrate.

Career Highlights

Redmond’s patent reflects work on materials and bonding methods for electronic components. The invention’s layered barrier is intended to support aluminum-wire bonding while separating the aluminum wire from the gold substrate.

Collaborations

Redmond’s listed coworkers include John W. Slemmons and Francis J. Woolston. The available information identifies them as coworkers but does not specify their roles in the patent.

Conclusion

Patrick J. Redmond’s “Barrier disk” patent documents a practical approach to controlling contact between dissimilar materials during wire bonding, connecting his inventive work with Rockwell International Corporation.