Neenah, WI, United States of America

Patrick J Heaney

This inventor holds 1 USPTO granted patent. Top assignee: E.i. Dupont De Nemours and Company. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Patrick J Heaney. Retrieved from https://idiyas.com/inventor/patrick-j-heaney

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Patrick J. Heaney: Threadline Splicing Invention

Introduction

Patrick J. Heaney is an inventor associated with Neenah, Wisconsin, and E. I. du Pont de Nemours and Company. His patent concerns a practical method for joining threadlines during manufacturing.

Latest Patents

The provided information identifies one patent associated with Heaney: “Apparatus and Method for Splicing Threadlines by Knot-Induced Thread Twist Entanglement.” The invention describes a manually assisted apparatus and method for joining a threadline from a standby spool to the running threadline from an active spool. It uses knot-induced twist entanglement to form the splice. The supplied record lists 1 patent and does not provide a filing or grant date, so the patent’s chronology cannot be established here.

Career Highlights

Heaney’s listed patent reflects work on manufacturing processes and threadline handling. The invention addresses the need to connect threadlines when transitioning between an active spool and a standby spool.

Collaborations

The supplied information names David R. Roland as Heaney’s coworker. It does not specify whether Roland collaborated on this patent or describe their respective roles.

Conclusion

Patrick J. Heaney’s recorded invention focuses on a knot-induced twist entanglement technique for splicing threadlines, linking his patent record to manufacturing process innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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