This inventor holds 3 USPTO granted patents. Top assignee: Amazon Technologies, Inc.. Active years: 2017-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2018
Title: Innovations of Patrick Dean Lewis
Introduction
Patrick Dean Lewis is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of electronic device packaging and shipping solutions. With a total of 3 patents to his name, Lewis continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is for an electronic device package. This package includes an enclosure designed to hold an electronic device securely. It features a closure flap that is coupled to the top of the package, allowing for easy access. The closure flap includes a tear strip for opening the package, and a sled is incorporated within the package to hold the electronic device in place. Additionally, the design includes a recessed top edge that exposes a pull tab when the closure flap is opened, enhancing user convenience. Another notable patent is for a dividable shipping package. This innovative package consists of two or more internal compartments that secure items for shipment. The compartments are enclosed by a cover with a detachment mechanism, which, when activated, reveals previously covered labels identifying the items within.
Career Highlights
Patrick Dean Lewis is currently employed at Amazon Technologies, Inc., where he applies his expertise in developing innovative packaging solutions. His work has significantly improved the efficiency and functionality of product shipping and handling.
Collaborations
Lewis has collaborated with notable colleagues, including Paul Grady Russell and John Kelly Cornell, contributing to a dynamic and innovative work environment.
Conclusion
Patrick Dean Lewis exemplifies the spirit of innovation through his patents and contributions to electronic packaging and shipping solutions. His work continues to influence the industry and enhance user experiences.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
