Location History:
- Ivrea, IT (2010 - 2017)
- Romano Canavese, IT (2022 - 2023)
Company Filing History:
Years Active: 2010-2023
Title: Paolo Cappello: Innovator in Multi-Chip Module Technology
Introduction
Paolo Cappello is a distinguished inventor based in Ivrea, Italy. He has made significant contributions to the field of technology, particularly in the development of multi-chip module (MCM) assemblies and inkjet printing systems. With a total of 7 patents to his name, Cappello's work showcases his innovative spirit and technical expertise.
Latest Patents
Cappello's latest patents include a multi-chip module (MCM) assembly that features a graphite substrate with multiple silicon chips mounted on its front surface. This assembly is designed to facilitate the feeding of different types of inks to each silicon chip through ink channels and feeding slots. Another notable patent is for a modular service station that services inkjet printheads in printing systems. This service station includes a frame with capping and wiping elements, as well as mechanisms for the horizontal and vertical movement of the printhead, ensuring efficient maintenance and operation.
Career Highlights
Throughout his career, Paolo Cappello has worked with prominent companies such as Sicpa Holding SA and Telecom Italia S.p.A. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects in the technology sector.
Collaborations
Cappello has collaborated with notable professionals in his field, including Mauro Mondino and Silvano Tori. These partnerships have further enriched his work and expanded the impact of his inventions.
Conclusion
Paolo Cappello's innovative contributions to multi-chip module technology and inkjet printing systems highlight his role as a leading inventor in the technology landscape. His patents and collaborations reflect a commitment to advancing the field and improving technological solutions.