Hsinchu, Taiwan

Pao-Yun Tang


Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 125(Granted Patents)


Location History:

  • Chungli, TW (1995)
  • Hsinchu, TW (1996 - 2001)

Company Filing History:


Years Active: 1995-2001

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7 patents (USPTO):Explore Patents

Title: Innovations of Pao-Yun Tang

Introduction

Pao-Yun Tang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of seven patents. His work focuses on improving bonding methods that enhance the reliability and efficiency of electronic components.

Latest Patents

One of his latest patents is the "Tape Automated Bonding Method and Bonded Structure." This invention provides a bonded structure and a method for joining a lead array to the conducting bonding pads of an integrated circuit element. The method utilizes an anisotropic conductive film with tape automated bonding, offering a low-cost solution that operates at lower temperatures and pressures. This innovation improves the dimensional stability of the bonded structure and ensures automatic encapsulation after bonding, which enhances reliability.

Another significant patent is the "Method for Tape Automated Bonding to Composite Bumps." This process involves bonding a tape-carrier through its finger leads to composite bumps on an IC chip. The composite bumps consist of a polymeric material layer and at least one metal layer, which reduces structural damage during bonding. The bonding process can be executed using various types of lead frames, making it versatile and efficient.

Career Highlights

Pao-Yun Tang is affiliated with the Industrial Technology Research Institute, where he continues to advance research in electronic bonding technologies. His innovative approaches have positioned him as a key figure in the development of reliable and cost-effective bonding methods for integrated circuits.

Collaborations

He has collaborated with notable colleagues such as Shyh-Ming Chang and Yu-chi Lee, contributing to the advancement of technology in their field.

Conclusion

Pao-Yun Tang's contributions to the field of integrated circuit technology through his innovative patents demonstrate his commitment to enhancing electronic bonding methods. His work not only improves the reliability of electronic components but also paves the way for future advancements in the industry.

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