The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1996
Filed:
Jun. 23, 1995
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
This invention provides a connection structure and methods of forming the connection structure which combines the advantages of composite bumps and conductive films formed of conductive particles in a non-conductive binder. The conductive film provides conductive particles in a non-conductive binder which can be placed on the input/output pads of an integrated circuit element or substrate. The conductive particles contact composite bumps comprised of a polymer body, having a relatively low Young's Modulus, and a conductive metal coating to form the connection structure. The relatively low Young's Modulus of the composite bumps greatly reduce the recoil forces during bonding. Because of the low recoil forces the connection can be formed with reduced bonding force and forces tending to separate the connection once formed are reduced. The non-conductive binder is cured to form the adhesive between the integrated circuit element and the substrate.