Melaka, Malaysia

Pao Meng Lee


Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: Pao Meng Lee: Innovator in Semiconductor Inspection Technology

Introduction

Pao Meng Lee is a notable inventor based in Melaka, Malaysia, recognized for his contributions to semiconductor inspection technology. With a total of two patents to his name, he has made significant advancements in the field, particularly in the area of lead inspection systems for semiconductor devices.

Latest Patents

Pao Meng Lee's latest patents include a three-dimensional lead inspection system. This innovative apparatus and method are designed to capture images of semiconductor edges and leads along two optical axes that have different directions in a plane perpendicular to the semiconductor device edge. The first image is a direct backlit image of the device, while the second image is taken along a direction corresponding to a second optical axis, which is reflected into a direction corresponding to the first optical axis. By forming these two images, it becomes possible to locate the leads of the semiconductor device in three dimensions. Another patent under his name is also a three-dimensional lead inspection system, which utilizes a prism to reflect images off its optical surfaces to the camera optical axis, enhancing the accuracy of lead detection.

Career Highlights

Throughout his career, Pao Meng Lee has worked with several prominent companies in the semiconductor industry. Notably, he has been associated with Asti Holdings Limited and Semiconductor Technologies & Instruments Pte. Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

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Conclusion

Pao Meng Lee's work in semiconductor inspection technology showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving the accuracy and efficiency of semiconductor device inspection processes.

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