Pao-Chung Lee

Title: Pao-Chung Lee: Innovator in Electro-Chemical Plating

Introduction

Pao-Chung Lee is a notable inventor based in Xiamen, China. He has made significant contributions to the field of electro-chemical plating, showcasing his expertise through his innovative patent.

Latest Patents

Pao-Chung Lee holds a patent for a "Method of Electro-Chemical Plating." This method involves delivering a catholyte to the cathode chamber, where it is maintained at a first temperature before entering the chamber. The anolyte is provided at room temperature and is subsequently cooled to a second temperature, which is equal to or lower than the first temperature, before being delivered to the anode chamber. The substrate's plating surface is immersed in the electrolyte, and a direct current (DC) voltage is applied to the biased substrate, attracting metal ions from the electrolyte to electroplate the metal onto the substrate. He has 1 patent to his name.

Career Highlights

Pao-Chung Lee is currently employed at United Semiconductor (Xiamen) Co., Ltd. His work at this company has allowed him to further develop his innovative ideas and contribute to advancements in semiconductor technology.

Collaborations

Some of his notable coworkers include Shouguo Zhang and Jinggang Li, who have likely collaborated with him on various projects within the semiconductor industry.

Conclusion

Pao-Chung Lee's contributions to electro-chemical plating demonstrate his innovative spirit and commitment to advancing technology in his field. His patent reflects a significant step forward in the methods used for electroplating, showcasing his expertise and dedication to innovation.