This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Geesun Intelligent Technology Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Panpan Li and Her High-Speed Cutting Device.
Introduction
Panpan Li is an inventor associated with Guangdong, China. Her patent work includes a high-speed cutting device designed to support the processing of material tape.
Latest Patents
Li is associated with 1 patent, titled “High-Speed Cutting Device.” The invention includes a mounting frame, a feeding mechanism, a linear chasing-cutting mechanism, an electrode guide plate, and an acceleration driving mechanism. Positioned on the discharging side of the electrode guide plate and behind the linear chasing-cutting mechanism, the acceleration mechanism drives the material tape at increased speed.
Career Highlights
Li is associated with Shenzhen Geesun Intelligent Technology Co., Ltd. Her patent describes an arrangement that combines cutting and material-tape acceleration mechanisms.
Collaborations
The provided information lists Wenwu Pang and Shunnan Cao as Li’s coworkers.
Conclusion
Panpan Li’s patent focuses on coordinating high-speed cutting with accelerated material-tape movement, reflecting her work in industrial equipment innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile