San Jose, CA, United States of America

Pak Yin Tam

This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pak Yin Tam. Retrieved from https://idiyas.com/inventor/pak-yin-tam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Pak Yin Tam: Wireless Communications Inventor

Introduction

Pak Yin Tam is an inventor based in San Jose, California, and is associated with Qualcomm Incorporated. His patent work addresses wireless-device operation in dual-SIM, dual-active configurations.

Latest Patents

Tam is named on one patent, Optimized Subframe Blanking for Dual SIM Dual Active. The invention describes a wireless device operating two transceivers in connected modes with separate radio access networks. When a communication on the second transceiver indicates that certain symbols should be canceled, the device can refrain from transmitting the affected remaining portion of a communication on the first transceiver. This approach coordinates transmissions across the two connections.

Career Highlights

Tam’s listed patent portfolio includes 1 patent. The patent reflects work on managing communication timing and transmission behavior in dual-SIM wireless devices.

Collaborations

Tam’s listed coworkers include Ravinder Kumar and Abbas Termos. The patent is associated with Qualcomm Incorporated.

Conclusion

Pak Yin Tam’s patent focuses on coordinating transmissions across two active wireless connections, contributing to Qualcomm’s work in mobile communications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…